Germany - Laboratory equipment, optical instruments and precision instruments (except glasses)

Description

General requirements:- 200 mm wafer platform for RTP and plasma oxidation,- Capable for at least two different process modules,- Fully automated wafer load and unload with at least two loading ports (from/to 25 slot carrier - placed by an operator; preferred four loading ports),- Tool installation in a cleanroom ISO 3 (class 3),- Electrical connection requirements IHP: 230/400VAC 50 Hz TN-S Net (separated N/PE),- Has to fulfill the actual "machinery, and amending Directive" (EC Machinery Directive),- SEMI S2/S8 certified,- Directive 2014/30/EU EMV must be fulfilled,- Full CE Confirmation,- Wafer with notch,- SECS II/GEM/HSMS interface,- Wafer carrier type Entegris KA198-80M-47C02,- Cluster Tool Control unit with appropriate software,- Guaranteed service for more than 10 years,- Delivery of the complete set of construction data (f. e. CAD files) and tool software for internal use (f. e. source code, SPS files, user interface),- No refurbished system (chambers, parts),- Additional 12 month warranty.Software:- Microsoft Windows 10,- Unexpected software problems related to the standard operation have to be solved free of charge,- All software changing regarding safety is free of charge,- RAID-data storage.Additional requirements:- All manuals as hard copies on normal paper, cleanroom paper and on CD,- Preventive maintenance schedule (parts, hours),- User interface labels translated into German language,- Safety and Operation manuals must be in German,- Connection ability of the tool PC and the handling on the IHP uninterrupted power supply unit,- Remote tool access for monitoring and for searching and viewing process logs and data trending,- Second tool control unit in the maintenance area,- Preferable ergonomic human machine interface,- Operator and maintenance training at customer's site,- Pre installation box for all media (vacuum, water, cooling air, exhaust, Ethernet, gases, etc.)),- Delivery of an extended spare part kit free of charge,- Source inspection,- Support for process matching to existing RTP tool,- Tool delivery according to INCOTERM 2010 DDP, DAP or CIP IHP.Optional requirements:- Support for development of new processes i.e. plasma oxidation of different materials (300 h on side process support).

Opportunity closing date

27 January 2020

Value of contract

to be confirmed