United States - TECHNOLOGY TRANSFER OPPORTUNITY: Packaging for SiC Sensors and Electronics (LEW-TOPS-127)

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Details

Provided by Open Opps
Opportunity closing date
10 April 2020
Opportunity publication date
12 April 2019
Value of contract
to be confirmed
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Description

Added: Apr 11, 2019 10:11 am

NASA's Technology Transfer Program solicits inquiries from companies interested in obtaining license rights to commercialize, manufacture and market the following technology.  License rights may be issued on an exclusive or nonexclusive basis and may include specific fields of use.  NASA provides no funding in conjunction with these potential licenses.

THE TECHNOLOGY: 

Innovators at NASA's Glenn Research Center have developed a planar, modular package that protects electronics and sensors more effectively in high-temperature conditions than previously available methods.  Lack of reliability at high temperatures, due to poor packaging, have discouraged the global application and large-scale commercialization of high-temperature electronics and sensors. Capable of preserving operations even in a 600°C environment, this innovation offers hermetic protection for silicon carbide (SiC)-based devices, such as dynamic pressure sensors, static pressure sensors, temperature sensors, acoustic impedance channels, and buried connecting wires.  This patented technology is a game-changer for industries that need semiconductor-based sensors and electronics to function optimally in high-temperature, extreme-vibration, and corrosive environments - from jet engine combustion chambers to nuclear power plants, and from deep-well drilling to Venus missions.

To express interest in this opportunity, please submit a license application through NASA's Automated Technology Licensing Application System (ATLAS) by visiting https://technology.nasa.gov/apply/license/LEW-TOPS-127

If you have any questions, please contact NASA Glenn's Technology Transfer Office at grc-techtransfer@mail.nasa.gov with the title of this Technology Transfer Opportunity as listed in this FBO notice and your preferred contact information.  For more information about licensing other NASA-developed technologies, please visit the NASA Technology Transfer Portal at https://technology.nasa.gov/

These responses are provided to members of NASA's Technology Transfer Program for the purpose of promoting public awareness of NASA-developed technology products, and conducting preliminary market research to determine public interest in and potential for future licensing opportunities.  No follow-on procurement is expected to result from responses to this Notice.

Opportunity closing date
10 April 2020
Value of contract
to be confirmed

About the buyer

Address
National Aeronautics and Space Administration HQ Code 210.H United States

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