Germany - Miscellaneous special-purpose machinery

Description

The planned acquisition comprises a cleanroom compatible cluster tool for sputter deposition and rapid thermal annealing of composite films and multilayers stacks for nanotechnological devices on 200 mm substrates. The main application of the tool is concentrated on film based nanotechologies with a special focus on metal-oxide based devices.The tool should consist of a central handling module, a magazine load lock and two process chambers, which allows the single wafer handling between the process chambers without vacuum break.For the sputter chamber intended materials are metals, e.g. Al, metal oxides and nitrides, e.g. TiO2, Ta2O5, TiN, perovskites, e.g. BiFeO3, YMnO3, semiconductors, e.g. Si, Ge, IGZO, as well as piezoelectric materials for NEMS, e.g. AlN. Therefore, a confocal sputter source arrangement of at least 3 sources in combination with a rotating substrate are necessary. The substrate table should have a heating functionality up to 600 oC with an allowed temperature deviation of ± 5 K over a 200 mm substrate. As an option, the chamber should include an active reactive gas control system based on a spectroscopic measurement principle, e.g. OES, to trace and adapt the flow of the reactive gases O2 and N2. The possibility to apply an RF-bias on the substrate table is an additional eligible option. Finally the chamber should have co-sputter-, rf-sputter, reactive sputter and programmable pulsed sputter functionalities as well as combinations of these. The allowed thickness deviation, less a 5 mm edge exclusion, depends on the process and the deposited materials. It should be roughly in the rage of ± 3 % up to ± 5 %.The RTP chamber should reach a maximum temperature of 1200 oC and a maximum heating ramp of 200 K/s. Less a 5 mm edge exclusion the temperature homogeneity over a 200 mm substrate should be ± 1 K. The chamber should be equipped with an active temperature control using corresponding pyrometers for in situ temperature measurement. A possibly operating of the chamber under high vacuum conditions is a desirable optional feature for the RTP module.

Opportunity closing date

17 July 2019

Value of contract

to be confirmed