France - Microelectronic machines and devices
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Details
Provided by
- Opportunity closing date
- 08 April 2020
- Opportunity publication date
- 16 March 2020
- Category
- 31712100
- Value of contract
- to be confirmed
- Your guide to exporting
Description
CEA Leti wishes to acquire a thickness measuring equipment for silicon wafers with a diameter of 300 mm capable of processing wafers with a diameter of 200 mm as an option.
This equipment should allow spectroscopic measurements in reflectivity and ellipsometry to determine the optical properties and thicknesses of various thin films (silicon oxides and nitrides, high-k materials, SiGe, SOI, etc.) and layer stacks. It must be able to measure patterned and unpatterned wafers.
The equipment will be installed in CEA-Leti's microelectronics clean room and will be used 24 hours a day.
- Opportunity closing date
- 08 April 2020
- Value of contract
- to be confirmed
About the buyer
- Address
- CEA/Grenoble 17 rue des Martyrs Grenoble Cedex 9 38054 France
- Contact
- charlotte.guerry@cea.fr
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